We design, develop and manufacture organic substrates, which are raw materials required in the electronics industry. We provide one-stop solution from design to volume production in our facility. O/ur products include ball-gridarray (BGA) packages, chip-scale packages (CSP), flip chips, advanced RF modules and systems-in-package (SiP). With the advent of the convergence of technologies between substrates and printed circuit boards (PCBs), we are diversifying into new products and development of micro-PCBs modules and advanced chip-on-board (COB) products.

We design, develop and manufacture equipment for the assembly, testing and finishing process of semiconductor manufacturing. We supply equipment for each individual process, as well as integrate the various processes into a
single machine using our in-house design capabilities. Our products include laser marking, de-flashing, plating, solder dipping, vision inspection, lead conditioning, packaging systems and chip test handlers.

We design, develop and manufacture precision engineering products used in the electronics, life sciences and aerospace industries. Our products include test sockets, device change kits, stiff eners and preventive maintenance kits, as well as distribution of engineering plastic products.

We develop processes and associated chemical formulations for surface finishing in the electronics industry including de-flashing, solder dipping and plating of the leads of semiconductor components and connectors.

We provide surface fi nishing services for highend specialised requirements in de-flashing and plating of connectors as well as contract manufacturing services such as re-packing, re-balling and modules assembly services to
the electronics manufacturing industry.