Equipment

Solder Dipping

Solder Dipping is used for devices with low pin counts, such as DIPs and TO packages, where a layer of solder is deposited onto the leads by dipping into a molten pool of solder in a controlled manner.

We have improved on the conventional techniques to address defects and achieve a higher level of consistency in solder quality, thickness and homogeneity.

We also provide a range of accessories for the solder dipping process including jigs, loaders and unloaders and solder dipping belts.

	All titanium construction No dropping of unit during process Least forming of solder ball Least heat loss in the solder bath Zero soldering defect

Soldering Jig

	Fully enclosed for safe and clean environment Copplerless solder bath Least dross formation

Soldering Dipping Bath