Precision Engineering

Golden Unit

This product is a high accuracy mechanical component for final inspection of integrated circuits. It is a standard for your inspection system as well as device identification. It may be made with known defects, such as coplanarity, pitch offset, bent lead, standoff, etc.

The packages available are all major Gull-winged and J-bend packages, Ball Grid Array packages and Land Grid Array packages.

Golden Unit

	Information Needed Device Samples Device Drawings Test Socket Sample/Drawing * Above criteria can be set based on customer. standards & specifications. Types of Packages QFP, TSOP, TQFP, PQFP, MQFP, VQFP TSSOP, PSOP, SSOP, QSOP, SOIC PLCC, SOJ SIP, ZIP FLEXIWATT, TO-220 BGA, uBGA, LGA * All packages can be customized accordingly