Corporate Profile
Substrates and System Packaging
Microcircuit Technology (S) Pte Ltd, a wholly-owned subsidiary of AEM Holdings Ltd., is a pioneer in Advanced Interconnects Substrate Design & Manufacturing in South-East Asia.
Our leading-edge technology is parallel with market demands and we provide substrates for many leading Integrated Device Manufacturers (IDM) and Semiconductor Assembly Packaging Subcontractors.
We have the ability to provide total one-stop solution from design to volume production in our ISO certified facility.
For more information, please visit us at http://www.mct2002.com
Laminate Substrates 
Product Range - Laminate Substrates
 RF Modules |
 PBGA/CSP/UTCSP |
 COB |
 Memory Modules |
Capabilities
Designed with scalable production capacity for ease of expansion, our manufacturing facilities totaled 12,200sqm boosts a minimum capacity of more than 18 million 27x27mm PBGA units or 170 million of 8x8mm CSP units equivalent per month.Quality & Reliability
With our strong commitment in delivering high quality and reliability products, we perform stringent QC and reliability test systems.- SPC Program
- Product Quality Check system
- Product Reliability in compliance with JEDEC and IPC specs.
- FMEA system
 Visual Inspect |
 Measurement |
 Conformance Check |
 Chemical Lab Analysis |
Technology
A Strong technology solution provider, where our development is in line with customers technology roadmap
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